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Home > Products > 10W 3V SMD 5050 Ceramic substrate 1000lm CREES XML2 U2 LED Chip for Flashlights
10W 3V SMD 5050 Ceramic substrate 1000lm CREES XML2 U2 LED Chip for Flashlights
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Product: views:510W 3V SMD 5050 Ceramic substrate 1000lm CREES XML2 U2 LED Chip for Flashlights 
Unit Price: Negotiated
Min.Order:
Supply:
Delivery: Shipment within days since the date of payment
Valid until: Long Term
Updated on: 2020-12-17 15:02
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Product Details
Product Description

10W 3V SMD 5050 Ceramic substrate 1000lm CREES XML2 U2 LED Chip for Flashlights

Price for the LED Chip only, the pcb is not included, contact us if you need assembly service.



Applications:

Outdoor lighting

·High Power LED Lamp

·Outdoor Engineering Lighting

·Indoor Commercial Lighting

·General Lighting

·Street Light,Spot Light,Wall Wash

·Directional Lighting

·StageLighting

·Video/Studio Lighting

Product Name
SMD 5050 High Power LED
Lumen
1000lm (U2)
Voltage
2.8-3.4V
Current
3000mA
Power
10W
Wavelenght (CCT)
5000-10000k (optional)
Lighting angle
120°
CRI
Ra≥70
ESD
4000V
Welding method
eutectic welding
Thermal resistance
5℃/W
Detailed Images

Product storage conditions

1. The product should be stored in a dry, relative humidity less than 30% environment, storage temperature of 5 ~ 30 °C.
2. Avoid external damage to the vacuum bag to prevent the bag from leaking and getting wet.
3. Pay attention to moisture. If it is wet, put the patch reel in a 60 °C oven for 24 hours. Remove the tape from the bag and weld the lamp in 12 hours.
4. LED lights that have been unsealed from the original packaging but have not been soldered should be stored in any of the following ways: When turned on, the LEDs can be resealed in the original vacuum bag. Store the parts in a sturdy metal container with a tightly fitted lid. Place the fresh desiccant and humidity card in a container and check that the relative humidity is less than 30%. Store the parts in a dry, nitrogen-purified cabinet or container and require the cabinet or container to effectively maintain relative humidity below 30%. After reopening, the reflow soldering is completed within 24 hours, and the workshop conditions are ≤30°C/60%RH. If there is no environment with a relative humidity below 30% for storage, one hour before reflow, it must be baked.
5. When stacking PCBs or components containing X-Series LEDs, do not drop all weight on the lens. The force exerted on the lens can cause the lens to fall off. A clearance of at least 2 cm should be left above the LED lens, and the foamed wrapper should not be used directly on the lamp. Force from the blister pack can damage the LED.
Packing & Delivery

Vacuum packaging+three layers of thick kraft paper carton


Cooperated with realiable logistics

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