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Product Description
Heavy wire bonder
Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder.
The most competitive 4 types: thin aluminum wire wedge bonder MDB-2575(25-75um aluminum wire);Wire wedge bonder
MDB-25125(25-125um aluminum wire); heavy aluminum wire wedge bonder MDB-7550(75-500um aluminum wire);gold wire ball bonder MDBB-1750(17-50um gold wire). they are very popular for small quantity production, school, institution, research department.
And the 3 automatic: automatic thin aluminum wire bonder MD-Etech1850(18-50um aluminum wire); automatic ball bonder MD-S800(15-50um Au or alloy wire); automatic heavy wire bonder MD-CWX-3710(125-500um Aluminum wire).
The most competitive 4 types: thin aluminum wire wedge bonder MDB-2575(25-75um aluminum wire);Wire wedge bonder
MDB-25125(25-125um aluminum wire); heavy aluminum wire wedge bonder MDB-7550(75-500um aluminum wire);gold wire ball bonder MDBB-1750(17-50um gold wire). they are very popular for small quantity production, school, institution, research department.
And the 3 automatic: automatic thin aluminum wire bonder MD-Etech1850(18-50um aluminum wire); automatic ball bonder MD-S800(15-50um Au or alloy wire); automatic heavy wire bonder MD-CWX-3710(125-500um Aluminum wire).
Applications
High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3、TO-3P、TO-3PF、TO-3PN、TO-3PL、TO-220F、TO-126、TO-12F、TO-66、TO-251、TO-202 etc.
Specification
electric requiement： | 220VAC±10％、50HZ、be sure connected to ground |
aluminium wire diameter： | 75～500μm (3～20mil) |
ultrasonic power： | 0－30W, two channel.can be set separately of the two point |
bond time： | 10－500ms，two channel |
bond force: | 30－1200g，two channel |
motorized Y： | 0－18mm |
microscope rate： | 7.5 and 15 |
working area： | Φ25mm |
light： | adjustable brightness |
size： | 620×610×560mm |
weight： | ~40kg |
Sample
Factory
Customer use
Packing & Delivery