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Company Capability | ||
Layers | 1-22 layers | |
Copper Thickness | 0.5-6 OZ | |
Material | FR4(Shengyi China,ITEQ,KB A+,HZ),HI-TG, FR06,Rogers, Taconic,Argon, Nalco,Isola and so on | |
Solder Mask | green, yellow,white, blue,black,red | |
Finished Surface | conventional hasl, lead free hasl, immersion gold, immersion tin,immersion silver, hard gold, OSP... | |
Silkscreen color | white,black | |
Products Type | HF(High-Frequency)&(Radio Frenquency)board,impendance controlled board, HDI board,BGA&Fine pitch board | |
Minimum line width/gap | 3.5/4mil(laser drill) | |
Minimum hole size | 0.15mm(mechanical drill)/4mil(laser drill) | |
Minimum Annlar Ring | 4mil | |
Max Copper thickness | 6OZ | |
Min Solder Mask Bridge | 0.08mm | |
Plugging Vias capability | 0.2-0.8mm | |