IceMOS Technology Limited

IceMOS is a global leader in the development and manufacture of high quality MEMS product substrates as well as advanced engineering substrates based on our wafer bonding technology. Our products include:Thick Film Silicon on Insulator (SOI)Silicon - Silicon Direct Bonded Wafers (SiSi)Double / Multi layer SOI and SiSiTrench isolation SOICavity SOIThrough Silicon Via InterconnectCustom Advanced Engineering SubstratesOur core expertise is in Wafer Bonding, Deep Reactive Ion Etch (DRIE) and wafer shaping.We utilise our expertise in DRIE to offer trench etch and refill services to customers on bulk Si substrates or on SOI. Combining both our SOI and trench etch and refill technology, we offer customers a unique dielectrically isolated substrate preparation service.SOI material is used widely in applications such as telecommunications products and optical devices, dielectrically isolated integrated circuits, solid state relays and micro machined components for MEMS sensors, actuators and... [Detailed Introduction]