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Home > Products > 4 inch Single Side Polished Silicon Wafer, CZ {100} , 525um, P Type - Prime Grade Silicon
4 inch Single Side Polished Silicon Wafer, CZ {100} , 525um, P Type - Prime Grade Silicon
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Product: views:24 inch Single Side Polished Silicon Wafer, CZ {100} , 525um, P Type - Prime Grade Silicon 
Unit Price: Negotiated
Min.Order:
Supply:
Delivery: Shipment within days since the date of payment
Valid until: Long Term
Updated on: 2020-12-17 13:14
  Negotiated
Product Details
FAQ

 

IceMOS Technology offers a world class custom polished wafer solution. IceMOS SSP wafers are an excellent substrate for double sided lithography processing; the IceMOS expertise and knowledge of the product and the processes allow for exceptional thickness control and surface roughness – ideal for a downstream wafer bonding process. 

 

 

Product Description

4 inch Prime Grade Single Side Polished (SSP) Silicon wafer , CZ {100}

ApplicationsMEMS, Microfluidics/flow sensors, Optoelectronics

 

 

 

Specification

 

 

 

Parameter

Specification Range

Wafer Diameter

100 mm

Wafer Thickness

600 µm - 550 µm

Total Thickness Variation (TTV)

  ≤10 µm

Bow

≤40 µm

Warp

≤40 µm

Dopant Type

P : Boron

Resistivity

0.1-0.5 Ohm-cm

Growth Method

CZ

Crystal Orientation

<100>

 

 

 

About IceMOS

Established in 2004, IceMOS Technology is focused on establishing itself as a best-in-class provider of cost effective/high performance Super Junction MOSFETs, MEMS solutions and Advanced Engineering Substrates.

IceMOS has developed an innovative deep trench MEMS Super Junction High Voltage MOSFET that outperforms competing solutions with a much simpler, lower cost process. 

IceMOS is a global leader in the development and manufacture of high quality MEMS product substrates as well as advanced engineering substrates based on our wafer bonding technology. Our products include:

  • Thick Film Silicon on Insulator (SOI)
  • Silicon – Silicon Direct Bonded Wafers (SiSi)
  • Double / Multi layer SOI and SiSi
  • Trench isolation SOI
  • Cavity SOI
  • Through Silicon Via Interconnect
  • Custom Advanced Engineering Substrates

IceMOS will work directly with the customer to develop a unique specialized product if this is not already on offer. 

Encompassing over ten years of expertise, unsurpassed manufacturing skill and the latest developments in technology, IceMOS ensures that each customer receives outstanding service from the point of initial enquiry through to product delivery. Along with offering innovative product development, design and specialized services, the engineering team at IceMOS provides an array of technical support.

The dedicated team offer customers the opportunity to receive tailored solutions and unique services by delivering the latest innovations in the Semiconductor industry.

Awarded the ‘ISO 9001:2000TS 16949 Automotive Quality Standard’ IceMOS is prided on continual investment in quality procedures.

 

  


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