The so-called water cooling and heat dissipation is to take the pump as the power to let the water-cooled liquid flow in the silicone tube, and flow in the hot water absorption cooling head and cooling pump circulation. The hot water cooling head transfers the heat of the heating hardware to the heat dissipation and discharge through the water coolant, while the fan cooling discharge reduces the liquid temperature and circulates to the pump until the hot water absorbs the cooling head.
As the storage circuit is connected, the static effect of the product will appear. This electrostatic effect
will adsorb silicon dust particles in the air to the surface of memory chips and PCB boards. In the long run, due to the accumulation of a large amount of dust, the silicone tube may lead to the decline of memory heat dissipation efficiency and even lead to short circuit of chip pins.
The design of integrated enclosure heat sink and heat dissipation band effectively seals the memory chip and circuit, and ensures that the memory chip and PCB board are not affected by dust.
Note: "water cooling" refers to the selection and use skills of silicone hose, which relies on water circulation at room temperature and disperses temperature through large ventilators. On the other hand, liquid nitrogen is cooled to below zero by a special machine to achieve better overclocking.
