● High reliability & High thermal conductivity
● High compressibility, soft and flexible
● High conductivity
● Natural tacky for both sides, no need adhesive
● Meet with the environmental requirements of ROHS and UL
Brand: |
none |
Address: |
China |
Min.Order: |
none |
Supply: |
none |
Valid until: |
Long Term |
Product Details
TCT-100 series thermal conductive silicon pad is high-performance, thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment and heat sink or product outer covering. Nice stickiness, flexibility, good compression performance and excellent heat conductivity are designed for TCT-100 series,which make the products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect.
Features & Benefits
Application Mode
● The filling between PCB and heat sink
● The filling between IC and heat sink or product outer covering
● The filling between IC and heat sink or product outer covering
Typical Applications:
● Communication equipment
● LED Light
● Switching power supply
● Back light model
● Medical equipment
● Mobile equipment
● Video equipment
● Networking equipment
● Household appliances
● Note books
Custom size, easy to use(Thermal silica film)
The size of the thermal silicone gasket can be cut according to the customer's requirements, and the special size can be die-cut. Easy to install. The manufacturer is convenient for mass production and the delivery period is stable.
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