Guangzhou Minder-Hightech Co.,Ltd(MINDER-HIGHTECH CO.LIMITED HONGKONG ) is focused on connection(welding).We are comprised by a group of high educated specialists,with the leader of overseas professor, some of us have more than 20 years welding experience,our goal is to provide high performance product but low price and exceeded service.We care for the safety of operator, this year, we developed a safety system in spot welding industry named SOFT TOUCH system,which can prevent heavy pinch point injury.We are specialized in most of the connection(welding) technics,the most application we have participated in are electronic component(resistance,capacitor,inductor),chip on board,automotive electronic accessories,cell phone,IC cards,motor armature commutator etc.By material, we have engaged in connecting the Aluminum, Copper, Brass, Au(gold), Platinum, Nickel, Enameled wire, etc. We also provided the full IC package line; and LED producing line; Crystal oscillator producing line; as well as the wafer machining equipment. Our product are classified into resistance spot welding,inverter seam welding, ultrasonic wire bonding,hot bar soldering,automatic TIN soldering,stud welding, all the product are with mature latest technology,high performance,high precision,and high reliability. At the same time, we maintain a good relationship with the high school scientific research institution,we know the newest connection(welding) technology direction all over the world, committed to give out the best connection(welding) solution to our global customer. We chose the most open and industrialized city-guangzhou-to be our base head place,to ensure the efficiency and rapidly response. These years,we proud of our growth with the famous company such as TPT,K&S,ASM,Bosch,Miyachi,Uniteck,Avio,Apollo,LPKF etc.
Business Type
Manufacturer, Trading Company, Business Service (Transportation, finance, travel, Ads, etc)
Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder. The most competitive 4 types: thin aluminum wire wedge bonder MDB-2575(25-75um aluminum wire);Wire wedge bonder MDB-25125(25-125um aluminum wire); heavy aluminum wire wedge bonder MDB-7550(75-500um aluminum wire);gold wire ball bonder MDBB-1750(17-50um gold wire). they are very popular for small quantity production, school, institution, research department. And the 3 automatic: automatic thin aluminum wire bonder MD-Etech1850(18-50um aluminum wire); automatic ball bonder MD-S800(15-50um Au or alloy wire); automatic heavy wire bonder MD-CWX-3710(125-500um Aluminum wire).
Applications
High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3、TO-3P、TO-3PF、TO-3PN、TO-3PL、TO-220F、TO-126、TO-12F、TO-66、TO-251、TO-202 etc.
Specification
electric requiement：
220VAC±10％、50HZ、be sure connected to ground
aluminium wire diameter：
75～500μm (3～20mil)
ultrasonic power：
0－30W, two channel.can be set separately of the two point
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